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Die Bonding Equipment - メーカー・企業と製品の一覧

Die Bonding Equipmentの製品一覧

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[Application Example] 3D Mounting with High-Precision Die Bonder

[Application Example] 3D Mounting with High-Precision Die Bonder

Submicron positional accuracy! High bonding load up to 1000N!

In the development of electronic devices, there is a constant demand for increased speed, higher density, and optimization of device size and functional integration. Recent technological trends have made it a critical issue to incorporate three-dimensional stacked structures into the implementation of microprocessors, memory, image sensors, and IR sensors. In response to various demands such as the reduction of pitch size, the need for miniaturization of devices, and the pursuit of thermal and electrical mechanical stability, optimization of internal wiring is required. To accommodate the increasing number of bumps, miniaturization of pitch size, and demands for reduced device height, high-precision die bonders and flip chip bonders that guarantee large bonding loads and extensive flatness are needed.

  • Bonding Equipment

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[Use Case] Implementation and Packaging of Optical Communication Devices

[Use Case] Implementation and Packaging of Optical Communication Devices

From prototype development to mass production! Ensuring high yield with manufacturing technology.

Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
  • others

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Technical Data: Bonding Technology for 3D Packaging

Technical Data: Bonding Technology for 3D Packaging

Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"

This document introduces various bonding methods used in 3D packaging. As a result of extensive prototype research, various chips with a high number of bumps (up to 143,000), narrow pitch widths (minimum 25μm), and small bump diameters (minimum 13μm) were mounted on substrates using the high-precision die bonder "FINEPLACER sigma." It presents experimental methods related to 3D packaging technology, the process parameters used, and the results obtained. [Contents (excerpt)] ■ Metal diffusion (MD) bonding, transient liquid phase bonding (TLPB) ■ Thermal compression bonding using pre-underfill ■ Liquid-solid diffusion bonding (SLID) ■ Thermal compression bonding ■ Eutectic bonding ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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Technical Data: Flip Chip Bonding to Organic Substrates

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

This document describes the characteristic evaluation of micro-assembly technologies utilized in manufacturing techniques such as anisotropic adhesive bonding, ultrasonic mounting, thermal combined ultrasonic mounting, and solder mounting. It includes an overview of flip chip bonding technology, as well as experimental results and discussions. A custom flip chip bonding technology inspired by solder bump technology was also experimentally validated. 【Contents】 ■ Introduction ■ Overview of Flip Chip Bonding Technology ■ Experimental Results and Discussion ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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[Blog] Joining Materials and Joining Methods

[Blog] Joining Materials and Joining Methods

We realize that our Daibonder has very high versatility! An explanation of bonding materials and bonding methods.

It is always interesting to learn about the chemicals used by customers in bonding technology. There are many factors to consider. Due to the diversity and characteristics of materials, such as low viscosity, high viscosity, and thixotropic media, it is necessary to take multiple parameters into account when selecting materials suitable for the application. Even more importantly, it is essential to invest in equipment that can build a profile that allows for a phased bonding process and ensures a seamless roadmap to the production process. Here, Finetech can make an impact on your research and development. In this blog, we introduce "bonding materials and bonding methods." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

  • Other mounting machines

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[Blog] Is rework a mature technology?

[Blog] Is rework a mature technology?

Here is how to determine which technology is suitable for your needs.

Fine Tech has been a company specializing in SMT rework and repair equipment since its founding over 25 years ago. Interestingly, the machine we first manufactured and continue to sell today has a placement accuracy of ±10μm. That said, now that 25 years have passed, the question posed in the title of this blog is indeed very valid. There are many rework systems on the market, including those with optical systems, those without, devices that use infrared as a heat source, and convection devices, among various types. In this blog, we discuss the topic, "Is rework a mature technology?" *For more details, you can view the content in the PDF document. Please feel free to contact us for more information.

  • Other mounting machines

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[Blog] Micro Assembly Day 2018

[Blog] Micro Assembly Day 2018

I learned about the tremendous efforts towards the reconstruction of the world-famous Berlin City Hall!

On May 17, 2018, approximately 50 European professionals from industry and academia participated in Fine Tech's Micro Assembly Day 2018. This one-day conference, held annually in Berlin, was organized to facilitate active knowledge sharing and experience exchange regarding new trends in high-precision packaging and micro assembly. In this blog, we introduce "Micro Assembly Day 2018 a Success." *For more detailed information, please refer to the PDF document. Feel free to contact us for more details.*

  • Other mounting machines
  • Other embedded systems (software and hardware)

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[Blog] A Few "Little Things" Related to SMTAi 2018

[Blog] A Few "Little Things" Related to SMTAi 2018

We are able to quickly provide solutions for the newly emerging microLED market!

I was invited to a session on rework and presented on the rework methods for highly miniaturized SMT components such as micro LEDs. Finetech has long been a company that provides complete solutions for microchip rework, but it seems that the definitions of "micro" and "small" have been changing year by year. In this blog, I will introduce some "small things" related to SMTAi 2018. *For more details, you can view the PDF materials. Please feel free to contact us for more information.

  • Other mounting machines

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Technical Data: Laser Bonding

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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[Use Case] High-precision assembly due to high optical resolution

[Use Case] High-precision assembly due to high optical resolution

Achieved an optical resolution of 0.7µm!

In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.

  • Bonding Equipment

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[Blog] Speed vs Throughput

[Blog] Speed vs Throughput

Two important variables to consider when choosing a device are speed and throughput!

In the world of contract manufacturing, we must consider the projects that may come in at any time. Therefore, to determine what kind of equipment to purchase, it is necessary to take into account many variables (factors). To ensure that contract manufacturers can produce high-quality products while competing, a suitable set of production equipment is required. In the world of contract manufacturing, it is not uncommon to handle dozens of products, ranging from small-scale items with fewer than 100 units to mass production. In the case of OEM, there may be a need to assemble thousands of products. This blog introduces the topic of "Speed vs Throughput." *For more detailed information, you can view the PDF materials. Please feel free to contact us for more details.*

  • Other mounting machines

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[Blog] Patience Due to COVID-19

[Blog] Patience Due to COVID-19

While sincerely acknowledging this situation, we continue to improve our business!

The word that may be suitable to describe the year 2020 is "Perseverance." Of course, this word applies not only to the dedicated employees of Fintech but to the entire world. Extraordinary sacrifices have been made for a greater cause, and it is not over yet. There have certainly been mistakes and lessons to learn. However, many people must have done what they believed to be right. Our Fintech offices around the world have endured shutdowns in regions including China, Malaysia, Japan, Europe, and the United States. Yet, while sincerely acknowledging this situation, our business continues to improve. In this blog, we discuss "Perseverance during COVID-19." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

  • Other services

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[Blog] Now, let's start the demonstration!

[Blog] Now, let's start the demonstration!

Remote acceptance testing for the purchased equipment! Offering various virtual experiences.

Due to COVID-19, we have become accustomed to seeing ourselves on screen. Of course, there is no problem with holding online meetings. However, to be honest, I don't really like seeing myself, and I think many people can relate to this feeling. Nevertheless, our sales team, application engineers, and product managers have become less shy about the camera. In this blog, we introduce "Can you see me? Let's start the demonstration!" *For more details, you can view the content in the PDF document. Please feel free to contact us for more information.

  • Other services

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Technical Data: Laser-Assisted Die Bonding

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding with such features is an effective technology newly added to Fine Tech's assembly and packaging technology. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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[Research Material] Global Market for Die Bonding Equipment

[Research Material] Global Market for Die Bonding Equipment

Global Market for Die Bonding Equipment: Fully Automatic, Semi-Automatic, Manual, Integrated Device Manufacturers (IDM), Outsourced Semiconductor Assembly and Test ...

This research report (Global Die Bonding Equipment Market) investigates and analyzes the current state and outlook for the global die bonding equipment market over the next five years. It includes information on the overview of the global die bonding equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include fully automatic, semi-automatic, and manual, while the segments by application focus on integrated device manufacturers (IDM) and outsourced semiconductor assembly and test (OSAT). The regional segments calculate the market size of die bonding equipment by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in die bonding equipment, product and business overviews, and sales performance.

  • Other services

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